Wafer edge inspection
The wafer edge inspection system measures the surface of the wafer with high precision using three image processing cameras. Defects larger than 300 nm are thus reliably detected. Defective wafers can significantly affect later process steps and result in shutdown of the production.
• Reliable defect detection
• 2 – 5 mm of the wafer edge
• high resolution image processing system
• Finds particles, cracks, scratches, point-shaped and flat defects, etching defects, crystal growth, contamination and geometry deviations
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