More precision
 

Wafer edge inspection

Ominaisuudet

• Reliable defect detection
•  2 – 5 mm of the wafer edge
•  high resolution image processing system
•  Finds particles, cracks, scratches, point-shaped and flat defects, etching defects, crystal growth, contamination and geometry deviations
back to product group "Semiconductor measurement"
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Contact
FI-Jouko-Kuosmanen

Jouko Kuosmanen

+358 40 8484 109
jouko.kuosmanen@micro-epsilon.fi
Find contact person
 
Micro-Epsilon Messtechnik
Königbacher Str. 15 94496 Ortenburg
info@micro-epsilon.de mobile phone icon
+49 8542 / 168 - 0 phone icon
+49 8542 / 168 - 90 fax icon